Key Responsibilities

Develop and optimize 300mm Silicon Photonics (SiPh) technology platforms, including pluggable modules, co-packaged optics (CPO), and photonic interposer solutions.

Collaborate with internal R&D and module engineering teams to define, develop, and execute SiPh process flows.

Engage with customers through technical discussions to align device and process requirements.

Coordinate with external OSATs and technology partners for PIC/EIC characterization and packaging integration.

Apply DOE, FMEA, and control plan methodologies to support technology development, risk management, and process optimization.

Analyze development data and implement improvement initiatives to enhance process performance and reliability.

Qualifications

Bachelor’s degree in Electronics Engineering, Electrical Engineering, Physics, Materials Engineering, or a related discipline.

Minimum 3 years of hands-on experience in Silicon Photonics (SiPh) R&D, process integration, or related semiconductor technology development.

Experience in SiPh process development, photonic IC packaging, optical device design, or characterization is preferred.

Familiarity with semiconductor foundry environments, including process integration or module-level development responsibilities.

Knowledge of DOE, FMEA, control planning, and data-driven problem-solving methodologies.

Strong communication and collaboration skills with the ability to work effectively with internal teams and external partners.

Interested applicants, please click “Apply Now” or email your detailed resume (MS Word or PDF) to: ••••@tempserv.com.sg

Tempserv Pte Ltd

EA License No: 06C3745

Consultant: Chuah Siew Ping/EA Personnel No: R24123260